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After the modification with the
peltier-cooler and the GlobalWin FDP-32 heatsink, I still wasn't satisfied with
the cooling performance. So I decided to build myself a water-cooler with which
I was going to cool the peltier. I had seen this at a friend of mine who cooled
the cold-plate on his Celeron 400A with the same peltier and a home-build
water-cooler down to -25° C (-13° F) while the CPU was at idle and rain was
turned on. While playing Unreal Tournament, the CPU temperature went up to
approximately 5° C (41° F). The water returning from the cooler is cooled by
letting it flow through the radiator of a Subaru Jumbo, while letting the fan on
this thing turn at a silent 3 V. He had his Celeron overclocked to 600MHz, the
power output at 2.3 V was 47 W (formula: Pactual =
Pdefault x (Vcore
/ Vdefault)2
x (foverclock / fdefault)
). I also calculated Pactual for my K6-2 450
running at 560 at 2.4 V, Pactual = 18.5 x (2.4
/ 2.2)2 x (560 / 450) = 27.4 W. This
power-output was considerably lower than that of the Celeron, so in theory I
should be able to cool my K6-2 under load better than the Celeron.
And this is how I did it:
I
started by designing a water-cooler which had to be easy to make and have good
cooling performance (you can download the Acad drawing here).
I had a 40 x 10 x 1000 mm copper-rod lying around, which I wanted to use. In the
drawing you can see that I did not drill the holes right next to each other on
the centerline, but I shifted them up and down around the centerline. I
did this so I could drill more holes in the cooler whereby the water would have
to take a longer way through the cooler and take up more heat in the process. Of
course the amount of heat absorbed by the water is also dependent on the
flow-speed of the water. If it flows too slow the warmer water will not be able
to take up any more heat and an upstream portion of the cooler
 So
after designing it, I cut 3 pieces from the copper-rod. 1 piece of 40 x 40 x 10
mm (the cooling-part) and 2 pieces of 40 x 3 x 10 mm (these 2 will seal the
cooler at both ends after the holes have been drilled). Then I drilled 6 4 mm
holes through the copper. At one side I drilled the 2 outside holes to 5 mm, 10
mm deep so the would accept the copper tubes. Then one of the small end-plates
was also drilled with 2 5 mm holes which fit exactly over the tubes.
 The
parts can not be soldered together yet, because first the holes have to be
connected to create a single continues duct through the copper. the connections
were made on a milling-machine, but can also be done by hand with a
boring-machine.
Now
the parts can be soldered together. This was done with Thin-Flo paste 175
(Castolin Eutectic). This chemical is smeared on the contacting parts which are
then lightly pressed together. with a blow-torch the parts are then heated,
which makes the chemical to transform from a dark-gray clay-like material to a
silver-isch soldering material which in its heated state flows in and nicely
fills any gaps still left between the parts. The cooler was tested with
compressed (3 bar) air for leaks.
So now that it was ready I was very
anxious to test it out. I "ripped" the FDP-32 of the peltier and
installed the water cooler. Since I only wanted to test it out without turning
on the computer I did not insulate it for condensation. After switching on the
power unit (see PART 1)
and the little 10 W aquarium circulation pump, I cranked the peltier up to full
power (15.8 V and 5.5 A) and down went the temperature. Within approximately 25
seconds the temperature of the cold-plate was down to -29° C (-20° F). Now
that was not bad, but of course the CPU did not produce any heat.
 So
after some careful planning I started to assemble the system properly (with the
right amounts of silver-grease between the parts) and also isolate it with green
compression foam, which I had left over from my work at Fokker. This foam
(forgive me for not knowing the exact name anymore) is able to withstand very
high temperatures (up to 200° C (392 ° F)) without melting or oxidizing. I cut
pieces so as to enclose the cpu and cooling-parts completely without leaving any
air between them. I also put a piece of foam in the cpu-foot under the cpu to
prevent any condensation from forming on the underside of the cpu. The foam
parts were connected by double-sided tape and are also "glued" to the
motherboard with this tape, but can easily be removed while providing an
excellent air-seal. The cooling unit was fastened to the motherboard with the
clamp that came with the FDP-32. I had to modify it because it wasn't long
enough anymore. To do this I just made 2 small hooks from piano-wire which I
attached to the clamp. As a finishing touch
I made a foam cover which I also attached with the double-sided tape.
So now everything was ready for a first
test run. I switched on the pump and the power unit, waited until the cold-plate
was -20° C (-4° F) and swithched on the computer. And there it went for the
first time with the water cooler at 2.4 V. It posted, booted, started Windows
and crashed. What the f*ck was that. That was not supposed to happen. I switched
the computer off and on again, now it didn't even get past the memory-check, it
just crashed. I didn't understand it, I was certain there could be no
condensation in the foam. So I decided that 2.4 V was not enough (since the cpu
only ran at 560 MHz at 2.7 V with just a Alpha heatsink). I tried every voltage
from 2.2 to 2.9 nothing worked.
And
then it hit me, the top of the cpu got so cold that in turn also the little
metal pins (you know the 237 something connections) got below freezing. Now that
was not a problem because it was all isolated. But the pins cooled the cpu-foot
on the motherboard below freezing (no problem, still isolated) but the foot was
soldered at the backside of the motherboard. Oops not isolated, I checked and
there they were, the most beautiful frozen drops of condensation I ever saw. :-)
So I cut a piece of foam and put it under the cpu on the backside of the
motherboard and my baby has been purring at 560MHz at 2.4 V very happily ever
since.
The temperatures with cpu idle and rain
on are: cpu -13° C (8.6° F), cold-plate -23° C (-9.4° F) and hot-plate 25°
C (77° F).
While running Unreal Tournament: cpu 3°
C (37° F), cold-plate -11° C (12° F) and hot-plate 28° C (82° F).
Unfortunately, I can only pump around
the same 5 liters of water continuously, without cooling it. This will change
when I also install a small radiator + fan from a car or motorbike. Since the
cpu is able to run at 560 MHz at 2.4 V now I will attempt to get it up to 616
(112 x 5.5) 616 MHz at a maximum of 2.7 V.
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